ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:

* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods
* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates
* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs
* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate
* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages
* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging
* Environmental issues for conventional PCBs and substrates
* Some environmentally conscious flame-retardants for PCBs and organic substrates
* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety
* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives
* Criteria, development approaches, and varieties of alloys and properties of lead-free solders
* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders
* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications
* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process
* Fundamental understanding of electrically conductive adhesive (ECA) technology
* Effects of lubricant removal and cure shrinkage on ECAs
* Mechanisms underlying the contact resistance shifts of ECAs
* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs
* Stabilization of contact resistance of ECAs using various additives

About the Author

John H. Lau received his PhD in theoretical and applied mechanics from the University of Illinois, an MASc in structural engineering from the University of British Columbia, a second MS in engineering physics from the University of Wisconsin, and a third MS in management science from Fairleigh Dickinson University. He also has a BE in civil engineering from National Taiwan University. John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of optoelectronic packaging and manufacturing technology.

C.P. Wong is a Regent's Professor at the School of Materials Science and Engineering and a Research Director at the NSF Packaging Research Center at the Georgia Institute of Technology. He received his BS in chemistry from Purdue University, and his PhD in chemistry from Pennsylvania State University with Nobel Laureate Professor Henry Taube.

Ning-Cheng Lee is the vice president of technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981 to 1982), Morton Chemical (1982 to 1984), and SCM (1984 to 1986). He has more than 18 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.