Silicon Germanium: Technology, Modeling, and Design

Silicon Germanium: Technology, Modeling, and Design, 9780471446538 (047144653X), John Wiley & Sons, 2003

Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM’s SiGe technology, this comprehensive guide quickly moves on to:

Detail many of IBM’s SiGe technology development programs
Explore IBM’s approach to device modeling and characterization--including predictive TCAD modeling
Discuss IBM’s design automation and signal integrity knowledge and implementation methodologies
Illustrate design applications in a variety of IBM’s SiGe technologies
Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design

Written for RF/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM’s advanced SiGe process technologies and design kits.

About the Author
RAMINDERPAL SINGH, PhD, is a Senior Engineer at IBM’s RF/AMS Design Kit Group where he leads various projects related to transmission line model development, substrate modeling, and RF/mixed-signal design methodologies. Dr. Singh has authored numerous technical publications in the area of signal integrity, and is Director of VSIA, as well as a Senior Member of IEEE.
DAVID L. HARAME, PhD, is Director of the RF/Analog and Mixed Signal Process Development, Modeling, and Design Automation area at IBM. He is an IEEE Fellow, Executive Committee member of the Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), and member of the Compact Model Council.
MODEST M. OPRYSKO, PhD, joined IBM in 1986 and has held numerous management positions directing technology and application development activities spanning the areas of fiber optics, wireless (infrared and radio frequency technology), packaging technology, and circuit design devoted to communications applications. Currently, he is the Senior Manager of Communication Link Architecture, Design and Test.

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