This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts....

Valentine P. Ananikov, Irina P. Beletskaya: Alkyne and alkene insertion into metal-heteroatom and metal-hydrogen bonds – the key stages of hydrofunctionalization process.- Akihiko Ishii* and Norio Nakata: The Mechanism for Transition Metal-Catalyzed Hydrochalcogenation of Unsaturated Organic Molecules.- A. L. Reznichenko and Kai C....

If you don't have the experience of working with fiberglass, any repairs to your boat must be done by high-cost professionals or left undone. This entry-level guide uses full-color, step-by-step photo sequences and line drawings to present you...

Expert laboratorians update the classic bioconjugation methods and introduce valuable new techniques that go beyond pure biomedical applications to include elements from advanced organic synthesis, molecular biology, and materials science. These readily reproducible methods cover the preparation of protein conjugates using covalent and...