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Three Dimensional System Integration: IC Stacking Process and Design
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more... | | Java Performance Companion
Java® Performance Companion shows how to systematically and proactively improve Java performance with today’s advanced multicore hardware and complex operating system environments.
The authors, who are all leading Java performance... | | Microsoft(r) Windows(r) 2000 Server Administrator's CompanionMICROSOFT WINDOWS 2000 SERVER ADMINISTRATOR'S COMPANION brings network administrators, systems engineers, and other MIS professionals up to speed on the latest features of Windows 2000 Server, including Active Directory(tm) services, Microsoft Internet Information Server 4.0, the new, integrated console for administrative tools, and more. It's the... |
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