 Three Dimensional System Integration: IC Stacking Process and Design
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more... |  |  Nanoscale Sensors (Lecture Notes in Nanoscale Science and Technology)
This book is a comprehensive introduction to nanoscale materials for sensor applications, with a focus on connecting the fundamental laws of physics and the chemistry of materials with device design. Nanoscale sensors can be used for a wide variety of applications, including the detection of gases, optical signals, and mechanical strain, and... |  |  Bayesian Argumentation: The practical side of probability (Synthese Library)
Relevant to, and drawing from, a range of disciplines, the chapters in this collection show the diversity, and applicability, of research in Bayesian argumentation. Together, they form a challenge to philosophers versed in both the use and criticism of Bayesian models who have largely overlooked their potential in argumentation. Selected from... |