In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management...

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with...

Thermal degradation of polymeric materials is an important issue from both the academic and the industrial viewpoints. Understanding the thermal degradation of polymers is of paramount importance for developing a rational technology of polymer processing and higher-temperature applications. Controlling degradation requires understanding of...

For decades, people have searched for ways to harvest energy from natural sources. Lately, a desire to address the issue of global warming and climate change has popularized solar or photovoltaic technology, while piezoelectric technology is being developed to power handheld devices without batteries, and thermoelectric technology is being...

Structural design in fire conditions is conceptually similar to structural design in normal temperature conditions, but often more difficult because of internal forces induced by thermal expansion, strength reduction due to elevated temperatures, much larger deflections, and numerous other factors. Before making any design decisions it is...