Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more...

This is a comprehensive guide to the techniques that allow engineers to simulate, analyze and optimize power distribution systems. Combined with automation, these techniques underpin the emerging concept of the smart grid. This book is of interest to consultants, manufacturers, contractors, utility engineers working with power distribution...

Responding to recent developments and a growing VLSI circuit manufacturing market, Technology Computer Aided Design: Simulation for VLSI MOSFET examines advanced MOSFET processes and devices through TCAD numerical simulations. The book provides a balanced summary of TCAD and MOSFET basic concepts, equations, physics, and new...

Richly illustrated and written in an easy-to-comprehend style, this highly accessible resource provides novice engineers and engineering students with a solid introduction to the use of electromagnetics (EM) simulation in RF design. Engineers learn how to use EM software to design microwave circuits and to conduct signal integrity analysis of...

Wish you could fix that faulty doorbell, hook up a motion detector, or maybe build your very own robot? This book will really get you charged up! It won't make...

Ideal for graduate and senior undergraduate level courses in computer arithmetic and advanced digital design, Computer Arithmetic: Algorithms and Hardware Designs provides a balanced, comprehensive treatment of computer arithmetic, covering topics in arithmetic unit design and circuit implementation that complement the architectural...