Three Dimensional System Integration: IC Stacking Process and Design
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more...
Distribution System Analysis and Automation (Power and Energy)
This is a comprehensive guide to the techniques that allow engineers to simulate, analyze and optimize power distribution systems. Combined with automation, these techniques underpin the emerging concept of the smart grid. This book is of interest to consultants, manufacturers, contractors, utility engineers working with power distribution...
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